We can provide customized and semi-customized services according to customer requirements.

The following customized services are available:

Custom Size:Min. 1.3 ", Max. 65";

Customizable Touch function:With water touch,gloved touch,passive pen touch,touch points (up to 10 points),multi-interface multi-system support;

Touch screen structure customization:G+G (Two-layer glass),G+F,G+F+F,P+G,P+F etc;

IC Solution customization:Cypress, Focaltech, Goodix, EETI, ILI, etc;

Cycle:Once solution confirmed, 2-3 work days for drawings,tooling and sample lead time 3-4 weeks.Urgent project can be expedited to 2 weeks.

Cover Customization

* Cover material: tempered glass(hardness up to 7H), PMMA.

* Cover Shape: support Profiled cutting, drilling.

* Cover color: silk printing with Different colors and Logo printing.

* Cover optical treatment: AG(Anti-glare) AR(Anti-reflective) AF(Anti-fingerprint)

* Cover Brand: AGC, Corning, CG, SG etc.

* Cover thickness: 0.55mm, 0.7mm, 1.1mm, 1.8mm,2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0, 8.0,10.0mm etc.

Sensor customization

* Sensor material:Glass, film

Sensor thickness: 0.3,0.4,0.55,0.7,1.0,1.1mm etc.

FPC customization：

Location:anywhere according to customer’s require.

Shape:flexible design according to the user's product structure needs.

Interface:IIC,USB,RS232 etc.

Module Bonding

* Air bonding:Double sided tape bonding

* Optical bonding:OCA bonding

* Custom process

1.Customer request；

2.we provide solution according to customer's requirements;

3.Both sides confirm the design drawings and solutions;

4.Arrange the production of tooling and samples;

5.Debugging touch screen to compatible with customer's mainboards;

6.Customer check & confirm samples;

7.Sample acceptance;

8.Mass production